产品展示
| 封装 | 概述 | 咨询 |
| GBP | Features： 1. Glass passivated chip 2. Low forward voltage drop 3. Low leakage current 4. High forward surge capability 5.High temperature soldering: 260℃/10S at terminals 6.Component in accordance to ROHS 2002/95/1 and WEEE 2002/96/EC Application： Lighting, power supply, drive | 具体详情请咨询我司 |
| GBU | Features： 1. Glass Passivated Bridge Rectifiers 2. Reverse Voltage - 50 to 1000Volts 3.Forward Current - 8~ -25Amperes option 4.Surge overload rating -200 amperes peak 5.Ideal for printed circuit board 6. Reliable low cost construction utilizing molded plastic technique 7. Plastic material has U/L flammability classification 94V-0 8. Mounting postition:Any 9. Weight: 0.138 ounces , 3.90grams Application： Power Supply, drive | 具体详情请咨询我司 |
| GBJ | Features： 1.Glass passivated chip junction 2. Ideal for surface mounted applications 3. Low leakage 4. High forward surge current capability 5. High temperature soldering guaranteed:260℃/10 seconds at terminals 6. Reliable low cost construction utilizing molded plastic technique 7. Plated terminals solderable per MIL-STD-202E 8. UL94V-0 rate flame retardant 9. 0.039 ounce, 1.1gram Application： Induction cooker, frequency converter, electric welding machine | 具体详情请咨询我司 |
| ABS | Features： 1. Glass passivated chip junction 2. Ideal for surface mounted applications 3. Low leakage 4. High forward surge current capability 5. High temperature soldering guaranteed: 260℃/10 seconds at terminals 6. UL94V-0 rate flame retardant 7. Plated terminals solderable per MIL-STD-202E method 208C 8. Weight: 0.02 ounce, 0.40 grams Application： Lighting, power supply | 具体详情请咨询我司 |
| MBF | Features： 1. Glass passivated chip:50mil 2. Glass passivated chip junction 3. Ideal for surface mounted applications 4.Low leakage 5. High forward surge current capability 6. High temperature soldering guaranteed:260℃/10 seconds at terminals 7. UL94V-0 rate flame retardant 8. Plated terminals solderable per MIL-STD-202E method 208C 9. Weight: 0.004 ounce, 0.120 gram Application: Lighting, power supply | 具体详情请咨询我司 |
| DBS | Features： 1. Glass passivated chip 2. Low forward voltage drop 3. Low leakage current 4. High forward surge capability 5. High temperature soldering: 260℃/10S at terminals 6. Component in accordance to ROHS 2002/95/1 and WEEE 2002/96/EC 7. Weight: 0.02 ounce, 0.40 grams Application： Lighting, power supply | 具体详情请咨询我司 |
| MBS | Features： 1. Glass passivated chip:50mil 2. Glass passivated chip junction 3. Ideal for surface mounted applications 4.Low leakage 5. High forward surge current capability 6. High temperature soldering guaranteed:260℃/10 seconds at terminals 7. UL94V-0 rate flame retardant 8. Plated terminals solderable per MIL-STD-202E method 208C 9. Weight: 0.004 ounce, 0.120 gram Application: Lighting, power supply | 具体详情请咨询我司 |
